The main advantages of electroplating equipment include high density, high precision manufacturing, low cost industrialized production, environmental protection and high performance.
Author: Anna
The main advantages of electroplating equipment include high density, high precision manufacturing, low cost industrialized production, environmental protection and high performance. Electroplating equipment has a wide range of applications in electronic packaging, circuit board production and other fields, and its advantages are mainly reflected in the following aspects:
High-density, high-precision manufacturing: electroplating technology with a variety of lithography, mask technology, to achieve high-density, high-precision metal film or line manufacturing. This is compared with the physical / chemical vapor deposition technology, electroplating equipment, less investment, simple process, especially suitable for large-scale low-cost industrialized production.
Environmental protection and high performance: Horizontal plating technology adopts full computer control, which can realize automated operation and reduce the pollution of working space and the impact of heat evaporation on the process environment. In addition, horizontal plating technology can also greatly save the amount of cleaning water, reduce the pressure of sewage treatment and improve production efficiency.
Good economic benefits: plating equipment in the initial cost can be recovered in 1-3 years, and circuit boards, plating plant wastewater can be recycled for the most part, reducing production costs. Fully automatic continuous system is suitable for large flow of wastewater recycling, stable quality of recycled water, which can be supplied to pure water system or directly back to the production line.
Multi-functional and adaptable: Plating equipment can realize various special functions to meet different product requirements by choosing different metal types and multi-layer combinations. This is especially obvious in the traditional lead frame type and ball grid array type packages, where plating technology ensures solderability, bonding and protection of the frame surface.
In summary, electroplating equipment has demonstrated significant advantages in a number of fields due to its high-precision manufacturing, environmental friendliness, high efficiency, good economic efficiency and versatility.