Global Semiconductor Lead Frame Market size was valued at USD 3.58 Bn. in and the total Semiconductor Lead Frame revenue is expected to grow by 5.2% from to , reaching nearly USD 5.10 Bn.Semiconductor Lead Frame Market Overview:
A semiconductor lead frame is a metal structure that holds and links the integrated circuit (IC), separate devices, as well as other parts found inside semiconductor devices. The main aim of a lead frame is to create an electrical pathway for signal exchange between the IC and the peripheral environment. Demand for electronic devices is growing rapidly, and the size of electronic components is getting smaller. This makes them more efficient. These factors are contributing to the increasing need for semiconductor lead frames. To know about the Research Methodology :- Request Free Sample Report The need for electronic gadgets like smartphones, computers, and car electronics is growing. When these sectors are growing, it directly affects the requirement for semiconductors and therefore also boosts demand for semiconductor lead frames. One main difficulty comes from a complicated supply chain that gets easily affected by disturbances such as natural disasters or political clashes. This causes delays in production and higher expenses as well. The semiconductor lead frames market is mainly led by Asia Pacific, as it has a strong position in global electronics production. Countries such as China, Japan, South Korea, and Taiwan are essential countries involved in the manufacture and assembly of semiconductors. North America also exhibits good potential growth due to higher requirements of connected devices, IoT implementation, and efforts made by the government to enhance local chip production. In the realm of competition, big names of semiconductor lead frame manufactures such as Toppan Inc., Mitsui High-tec Inc., SDI Group Inc., and Advanced Assembly Materials International Ltd. experience high rivalry from strong competitors that are already well-established as well as emerging ones in both local and international markets. These companies use strategic partnerships and technological advancements to stay competitive in the semiconductor lead frame market.Global Semiconductor Lead Frame Market Dynamics:
Driverssize was valued at USD 3.58 Bn. in and the total Semiconductor Lead Frame revenue is expected to grow by 5.2% from to , reaching nearly USD 5.10 Bn.A semiconductor lead frame is a metal structure that holds and links the integrated circuit (IC), separate devices, as well as other parts found inside semiconductor devices. The main aim of a lead frame is to create an electrical pathway for signal exchange between the IC and the peripheral environment. Demand for electronic devices is growing rapidly, and the size of electronic components is getting smaller. This makes them more efficient. These factors are contributing to the increasing need for semiconductor lead frames. The need for electronic gadgets like smartphones, computers, and car electronics is growing. When these sectors are growing, it directly affects the requirement for semiconductors and therefore also boosts demand for semiconductor lead frames. One main difficulty comes from a complicated supply chain that gets easily affected by disturbances such as natural disasters or political clashes. This causes delays in production and higher expenses as well. The semiconductor lead frames market is mainly led by Asia Pacific, as it has a strong position in global electronics production. Countries such as China, Japan, South Korea, and Taiwan are essential countries involved in the manufacture and assembly of semiconductors. North America also exhibits good potential growth due to higher requirements of connected devices, IoT implementation, and efforts made by the government to enhance local chip production. In the realm of competition, big names of semiconductor lead frame manufactures such as Toppan Inc., Mitsui High-tec Inc., SDI Group Inc., and Advanced Assembly Materials International Ltd. experience high rivalry from strong competitors that are already well-established as well as emerging ones in both local and international markets. These companies use strategic partnerships and technological advancements to stay competitive in the semiconductor lead frame market.
1. The Demand for the Electronics Industry is increasing: The Demand in the Electronics Industry has a big impact on the Semiconductor Lead Frame Market. This demand is connected to the requirements of people such as electronic gadgets such as smartphones, computers, car electronics, and many other types of consumer electronics. When these areas grow, it also increases the need for semiconductors which then affects how much lead frames are needed. Manufacturers in this market typically make alterations to production volumes and tactics, depending on the changes occurring within the electronics market.
2. Growth of the Automotive Industry: This is another important factor that's influencing the Semiconductor Lead Frame Industry. The automotive sector is a big user of semiconductor lead frames because electronic parts are becoming more and more integrated into vehicles. This integration covers different functions such as safety features, infotainment systems as well as advances in self-driving technology. With the ongoing advancements made by automotive manufacturers as they include more electronic parts in their vehicles, there is a significant increase in demand for semiconductors and therefore lead frames.
3. A surge in IoT Devices: The Rise in IoT Devices is also affecting the Semiconductor Lead Frame Market. The increase in the use and availability of Internet of Things (IoT) devices across different industries and homes creates a higher need for small, powerful, and affordable semiconductors. Due to this, there is a direct rise in demand for lead frames. The growing use of IoT devices in all parts of daily life, like smart homes and industrial automation, causes a consistent and important demand for products from the Semiconductor Lead Frame Market.
Market Driver for Value Change in Percent () Automotive market growth XX GDP Growth XX Inflation Impact XX Russia-Ukraine war Impact XX Excessive Supply of Memory chips XX Memory-integrated circuits prices drop XX Weakened demand for electronics market XX Restraints1. Complex supply chain: The semiconductor lead frame market, is very dependent on a worldwide supply chain. Any disturbances in this chain - like natural calamities, political conflicts, and trade obstacles - result in production delays as well as there is an increase in production cost.
2. Growing Competition of the semiconductor lead frames: The business of semiconductor lead frames faces strong competition, as many producers are trying to get their place in the market. This tough rivalry causes price stress and reduces profit margins for companies dealing with this industry. Hence, this hampers the market growth as well.
3. Shift Towards Advanced Packaging Technologies: The semiconductor field is going through a change in packaging methods. More advanced ways, like flip-chip and wafer-level packaging, might lessen the need for older lead frame packages.
4.Cost Constraints: The semiconductor industry places a strong focus on cost factors. Lead frame producers must find an equilibrium between providing top-notch items and doing so in a manner that is competitively priced to keep up with the market's demands.
Opportunities1. 5G Technology: The appearance of 5G technology has brought a big increase in the need for semiconductor parts that are important to telecommunications infrastructure, mobile devices, and IoT gadgets. Lead frames have an essential function in packaging high-frequency RF (radio frequency) components necessary for 5G operation which is why there could be opportunities for growth among makers of lead frames.
2. Advanced Packaging Technologies: The increasing move towards smaller sizes and intricacy of semiconductor devices is pushing up the requirement for sophisticated packaging technologies. Lead frames are adjusting to these needs, bringing in advancements such as thinner forms, more delicate spacing, and better heat handling. Businesses that can advance in these areas are well-positioned to take advantage of Semiconductor Lead Frame industry opportunities.
3. Emerging Markets: Electronic products are in demand as industrialization and urban growth continue to rise in emerging markets. As these economies advance, the need for semiconductors and related packaging solutions such as lead frames is also increasing. Hence, there is a growing business chance for suppliers of the lead frame to meet the changing demands of these growing markets.
4. Collaboration and Partnerships: The partnership between semiconductor manufacturers, packaging firms, and lead frame suppliers has the potential to drive innovations and open new market avenues. With the formation of strategic partnerships and alliances, companies gain a competitive advantage in the semiconductor lead frame market. This helps them explore new technologies and market segments.
Global Semiconductor Lead Frame Market Segment Analysis
Based on Type: Stamping is a process where metal sheets are positioned beneath a die that forms the sheet into its shape by exerting pressure on it. The stamping method is used for molding metal sheets, but it also be applied to other materials such as Based on the Application: The segmentation of the market is into integrated circuits, discrete devices, and others. The use of lead frames has been increasing in Integrated Circuits (ICs) such as those found in smartphones, tablets, and other electronic devices. They hold a major application for automotive infotainment devices and are also popularly used by the consumer electronics industry due to their benefits such as small size that is made even more compact with lesser costs along with good dissipation properties making it easy to handle heat efficiently. These benefits lessen the complexity of product handling and slow down the expansion of integrated circuits in the lead frame market. In this digital time where IoT operational tools and industrial applications have encouraged using discrete devices that are single ICs with fast response abilities. There was also significant demand from other uses such as medical equipment and remote devices which required lead frames.Semiconductor Lead Frame Market Regional Insights:
Asia Pacific region has the largest market share in the semiconductor lead frame market, mainly due to it being a worldwide center for making electronics. China, Japan, South Korea, and Taiwan are key countries in producing and assembling semiconductors. Also, its strong supply chain of semiconductor devices from main nations such as Taiwan and South Korea has increased sales of electronic products as there has been more production growth seen within discrete devices along with logic circuits plus circuits happening in places such as Taiwan, Japan China as well as India. The devices find broad applications in consumer electronics, automotive, industrial, and commercial sectors. The increasing demand for semiconductor lead frames is being driven by the fast-growing automotive and consumer electronics sectors in Asia-Pacific. As the region keeps on adopting new ideas and experiencing economic development, it stays as a main player in the semiconductor lead frame market. China is the source of a large majority of lead frames, which are exported mainly to the United States, India, and Vietnam. It holds 3rd place in the list of countries exporting Lead-frames around the world. The top three countries that export Lead frames are Japan which has over 6,500 shipments followed by South Korea in second position with over 6,000 and lastly, China in third spot having over 5,500 shipments respectively. The Philippines takes first place among the top 3 importers of Semiconductor Lead frames, having more than 11,000 shipments counted. The second place goes to Vietnam with a total of over 10,500 shipments and Indonesia ranks third having received above 6,500 shipments. The market in North America is expected to increase at a certain CAGR during the forecast period. This can be attributed to factors such as the growing demand for connected devices, adoption of IoT, and supportive government policies along with initiatives aimed at increasing domestic semiconductor component production in this region. The most important firms within the semiconductor sector are deploying a considerable amount of monetary resources towards growing their semiconductor facility in North America. Top Importers of the Semiconductor Lead Frame Market (No. of Shipments) Japan + South Korea + China + Top Exporters of the Semiconductor Lead Frame Market (No. of Shipments) Philippines + India + Poland + Competitive Landscape: Toppan Inc., being a major participant in the Semiconductor Lead Frame Market, encounters competition coming from different sides. Mitsui High-tec Inc., Shinko Electric Industries Co. Ltd., and Advanced Assembly Materials International Ltd. are companies that cause considerable difficulty because of the wide range of products they offer and their established place in the market. Advanced Assembly Materials International Ltd. has to face rivals that are top players in this industry like Toppan Inc., SDI Group Inc., and Precision Micro Ltd. These big companies provide a variety of lead frame solutions and already have good connections with main semiconductor manufacturers. Semiconductor Lead Frame Market, SDI Group Inc. deals with strong competition from companies like Toppan Inc., Amkor Technology, and ASM Pacific Technology. They have good experience in this industry, a worldwide market reach, and a variety of products to offer. The competition is also high because of Asian manufacturers such as SHINKO ELECTRIC INDUSTRIES CO. LTD. who are constantly innovating with their low-cost methods for production as well as newer technologies they introduce into the sector. The competition in the market of Semiconductor Lead Frames is tough. Mitsui High-tec Inc. has to deal with big players like Toppan Inc., SDI Group Inc., and Amkor Technology who use their global reach, technology skills, and varied product range as advantages for staying at the top position in this field. The objective of the report is to present a comprehensive analysis of the global Semiconductor Lead Frame Market to the stakeholders in the industry. The past and current status of the industry with the forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that include market leaders, followers, and new entrants. PORTER, PESTEL analysis with the potential impact of micro-economic factors of the market has been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which gives a clear futuristic view of the industry to the decision-makers. The reports also help in understanding the Global Semiconductor Lead Frame Market dynamic, and structure by analyzing the market segments and projecting the Global Semiconductor Lead Frame Market size. Clear representation of competitive analysis of key players By Price Range, price, financial position, product portfolio, growth strategies, and regional presence in the Global Semiconductor Lead Frame Market make the report an investor&#;s guide.Semiconductor Lead Frame Market Scope:Inquire Before Buying
Global Semiconductor Lead Frame Market Report Coverage Details Base Year: Forecast Period: - Historical Data: to Market Size in : US $ 3.58 Bn. Forecast Period to CAGR: 5.2% Market Size in : US $ 5.10 Bn. Segments Covered: by Type Stamping Process Lead Frame Etching Process Lead Frame Others by Application Integrated Circuits (IC) Discrete Device OthersSemiconductor Lead Frame Market, by Region
North America (United States, Canada and Mexico) Europe (UK, France, Germany, Italy, Spain, Sweden, Austria and Rest of Europe) Asia Pacific (China, South Korea, Japan, India, Australia, Indonesia, Malaysia, Vietnam, Taiwan, Bangladesh, Pakistan and Rest of APAC) Middle East and Africa (South Africa, GCC, Egypt, Nigeria and Rest of ME&A) South America (Brazil, Argentina Rest of South America)Semiconductor Lead Frame Market, Key Players are
Semiconductor Lead Frame Market Key Players for North America 1. SDI Group Inc.- United States 2. Semiconductor Lead Frame Market Key Players for Europe 1. Advanced Assembly Materials International Ltd.- United Kingdom 2. POSSEHL- Germany 3. Precision Micro Ltd.- United Kingdom Semiconductor Lead Frame Market Key Players for Asia Pacific 1. Toppan Inc.- Japan 2. SHINKO ELECTRIC INDUSTRIES CO. LTD.- Japan 3. Mitsui High-tec Inc.- Japan 4. QPL Electronics Factory- China 5. Ningbo Kangqiang Electronics Co. LTD.- China 6. Chang Wah Technology Co. Ltd- Taiwan 7. Haesungds- South Korea 8. Wuxi Huajing Leadframe Co. Ltd- China 9. Dynacraft Industries Sdn Bhd- Malaysia 10. Frequently Asked Questions: 1] What segments are covered in the Semiconductor Lead Frame Market report? Ans. The segments covered in the Semiconductor Lead Frame Market report are based on Type and Application. 2] Which region is expected to hold the highest share in the global Semiconductor Lead Frame Market? Ans. Asia Pacific is expected to hold the highest share of the global Semiconductor Lead Frame Market. 3] What is the market size of the global Semiconductor Lead Frame Market by ? Ans. The market size of the global Semiconductor Lead Frame Market by is US $ 5.10 Bn. 4] Who are the top key players in the global Semiconductor Lead Frame Market? Ans. Toppan Inc., Mitsui High-tec Inc., Shinko Electric Industries Co. Ltd., Advanced Assembly Materials International Ltd., etc are the top key players in the global Semiconductor Lead Frame Market. 5] What was the market size of the global Semiconductor Lead Frame Market in ? Ans. The market size of the global Semiconductor Lead Frame Market in was US $ 3.58 Bn.Stamping is a process where metal sheets are positioned beneath a die that forms the sheet into its shape by exerting pressure on it. The stamping method is used for molding metal sheets, but it also be applied to other materials such as polystyrene . Stamping happens with automated machines; the die gets fitted in these and instructions are given to the computer attached to the machine so all metal sheets coming through get reshaped into the same form of die. The use of the stamping method is very significant in the creation of semiconductor lead frames. This technique aids in producing frames that are tiny in size. The cutting down of frame sizes is crucial for boosting electronic device efficiency. This development, together with the rising demand for smartphones, is expected to drive up the use of this method in making lead frames which aid in growing the market size of semiconductor lead frame market. The segmentation of the market is into integrated circuits, discrete devices, and others. The use of lead frames has been increasing in Integrated Circuits (ICs) such as those found in smartphones, tablets, and other electronic devices. They hold a major application for automotive infotainment devices and are also popularly used by the consumer electronics industry due to their benefits such as small size that is made even more compact with lesser costs along with good dissipation properties making it easy to handle heat efficiently. These benefits lessen the complexity of product handling and slow down the expansion of integrated circuits in the lead frame market. In this digital time where IoT operational tools and industrial applications have encouraged using discrete devices that are single ICs with fast response abilities. There was also significant demand from other uses such as medical equipment and remote devices which required lead frames. Asia Pacific region has the largest market share in the semiconductor lead frame market, mainly due to it being a worldwide center for making electronics. China, Japan, South Korea, and Taiwan are key countries in producing and assembling semiconductors. Also, its strong supply chain of semiconductor devices from main nations such as Taiwan and South Korea has increased sales of electronic products as there has been more production growth seen within discrete devices along with logic circuits plus circuits happening in places such as Taiwan, Japan China as well as India. The devices find broad applications in consumer electronics, automotive, industrial, and commercial sectors. The increasing demand for semiconductor lead frames is being driven by the fast-growing automotive and consumer electronics sectors in Asia-Pacific. As the region keeps on adopting new ideas and experiencing economic development, it stays as a main player in the semiconductor lead frame market. China is the source of a large majority of lead frames, which are exported mainly to the United States, India, and Vietnam. It holds 3rd place in the list of countries exporting Lead-frames around the world. The top three countries that export Lead frames are Japan which has over 6,500 shipments followed by South Korea in second position with over 6,000 and lastly, China in third spot having over 5,500 shipments respectively. The Philippines takes first place among the top 3 importers of Semiconductor Lead frames, having more than 11,000 shipments counted. The second place goes to Vietnam with a total of over 10,500 shipments and Indonesia ranks third having received above 6,500 shipments. The market in North America is expected to increase at a certain CAGR during the forecast period. This can be attributed to factors such as the growing demand for connected devices, adoption of IoT, and supportive government policies along with initiatives aimed at increasing domestic semiconductor component production in this region. The most important firms within the semiconductor sector are deploying a considerable amount of monetary resources towards growing their semiconductor facility in North America.Toppan Inc., being a major participant in the Semiconductor Lead Frame Market, encounters competition coming from different sides. Mitsui High-tec Inc., Shinko Electric Industries Co. Ltd., and Advanced Assembly Materials International Ltd. are companies that cause considerable difficulty because of the wide range of products they offer and their established place in the market. Advanced Assembly Materials International Ltd. has to face rivals that are top players in this industry like Toppan Inc., SDI Group Inc., and Precision Micro Ltd. These big companies provide a variety of lead frame solutions and already have good connections with main semiconductor manufacturers. Semiconductor Lead Frame Market, SDI Group Inc. deals with strong competition from companies like Toppan Inc., Amkor Technology, and ASM Pacific Technology. They have good experience in this industry, a worldwide market reach, and a variety of products to offer. The competition is also high because of Asian manufacturers such as SHINKO ELECTRIC INDUSTRIES CO. LTD. who are constantly innovating with their low-cost methods for production as well as newer technologies they introduce into the sector. The competition in the market of Semiconductor Lead Frames is tough. Mitsui High-tec Inc. has to deal with big players like Toppan Inc., SDI Group Inc., and Amkor Technology who use their global reach, technology skills, and varied product range as advantages for staying at the top position in this field. The objective of the report is to present a comprehensive analysis of the global Semiconductor Lead Frame Market to the stakeholders in the industry. The past and current status of the industry with the forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that include market leaders, followers, and new entrants. PORTER, PESTEL analysis with the potential impact of micro-economic factors of the market has been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which gives a clear futuristic view of the industry to the decision-makers. The reports also help in understanding the Global Semiconductor Lead Frame Market dynamic, and structure by analyzing the market segments and projecting the Global Semiconductor Lead Frame Market size. Clear representation of competitive analysis of key players By Price Range, price, financial position, product portfolio, growth strategies, and regional presence in the Global Semiconductor Lead Frame Market make the report an investor&#;s guide.(United States, Canada and Mexico)(UK, France, Germany, Italy, Spain, Sweden, Austria and Rest of Europe)(China, South Korea, Japan, India, Australia, Indonesia, Malaysia, Vietnam, Taiwan, Bangladesh, Pakistan and Rest of APAC)(South Africa, GCC, Egypt, Nigeria and Rest of ME&A)(Brazil, Argentina Rest of South America)1. SDI Group Inc.- United States 2. Amkor Technology - United States 3. Jentech- United States1. Advanced Assembly Materials International Ltd.- United Kingdom 2. POSSEHL- Germany 3. Precision Micro Ltd.- United Kingdom1. Toppan Inc.- Japan 2. SHINKO ELECTRIC INDUSTRIES CO. LTD.- Japan 3. Mitsui High-tec Inc.- Japan 4. QPL Electronics Factory- China 5. Ningbo Kangqiang Electronics Co. LTD.- China 6. Chang Wah Technology Co. Ltd- Taiwan 7. Haesungds- South Korea 8. Wuxi Huajing Leadframe Co. Ltd- China 9. Dynacraft Industries Sdn Bhd- Malaysia 10. ASM Pacific Technology - Hong Kong 11. Samsung- South Korea 12. Kangqiang- China 13. Enomoto- Japan 14. DNP- Japan 15. Fusheng Electronics- ChinaThe segments covered in the Semiconductor Lead Frame Market report are based on Type and Application.Asia Pacific is expected to hold the highest share of the global Semiconductor Lead Frame Market.The market size of the global Semiconductor Lead Frame Market by is US $ 5.10 Bn.Toppan Inc., Mitsui High-tec Inc., Shinko Electric Industries Co. Ltd., Advanced Assembly Materials International Ltd., etc are the top key players in the global Semiconductor Lead Frame Market.The market size of the global Semiconductor Lead Frame Market in was US $ 3.58 Bn.
A coil is a generic name for an electrode in the shape of a spiral. Among the different types of coils, there are coils called &#;inductors&#; which are used for electrical applications. Inductors can be further categorized into RF inductors used for signal processing, and power inductors for power supply lines. The power inductors discussed in this section form part of the voltage conversion circuit in a DC-DC converter or other device.
Here we will explain the operation of a power inductor in a DC-DC converter. A power inductor is used in a step-up, step-down, or step-up/step-down circuit to convert a certain voltage to the required voltage. Among those different circuits, it is primarily used in a type of circuit called a &#;switching regulator.&#;
Figure 1-1 shows an example of a switching regulator step-down circuit.
It uses an IC, power inductor, and capacitor to convert a DC input voltage to the required output voltage. The power inductor works with the capacitor to play the role of rectifying the rectangular wave output from the IC to a direct current (further details are explained in Chapter 2).
If either one of these components is missing, the output cannot be properly rectified.
Figure 1-1 Overview of a step-down switching regulator
Now what parameters should you pay attention to when selecting a power inductor? The power inductor catalogs of each manufacturer list the following principal specifications. Figure 1-2 shows an example of a specification table.
Figure 1-2 Power inductor characteristic table
However, we don&#;t know the right specification for which power inductor to choose with only this information. For example, questions such as whether a high or low inductance is better, or what rated current is required, must be considered to appropriately choose an inductor according to the operating conditions of the DC-DC converter. In this chapter, we will cover how to read power inductor specifications.
The inductance value is an extremely important parameter which affects the ripple current and load response characteristics. As shown in Figure 1-3, an exponential current flows through a power inductor used in a DC-DC converter. Generally speaking, it is considered to be a good idea to set the ripple current &#;IL to about 30% of the load current Iout. Therefore, once the DC-DC converter conditions are decided, you can calculate the proper power inductor inductance with the following equation.
Figure 1-3 Current waveform flowing through a power inductor
However, most DC-DC converters list the proper inductance value as a reference. Therefore, you can also follow the manufacturer reference to select the power inductor without calculating the formula above.
The rated current stipulates the current value at which the quality can no longer be guaranteed once the DC current exceeds it. The rated current of a power inductor stipulates a value for the DC superposition rated current (Saturation) and a value for the temperature increase rated current (Temperature). The meaning of each value is important, so in many cases they are listed as separate specifications.
&#;&#;DC superposition rated current Isat
One characteristic of an inductor is the DC superposition characteristic. To obtain a high inductance, ferrite and other magnetic materials are used in the core (magnetic core) of the inductor. When a current flows through the inductor, the phenomenon called the magnetic saturation of the magnetic substance occurs, and the inductance decreases. This characteristic is called &#;DC superposition.&#; The DC superposition rated current stipulates the current value when this inductance decreases at a constant rate with regard to the initial characteristic that the current is not superimposed on.
&#;&#;Temperature increase rated current Itemp
This is the rated current requirement which uses component heat generation as an index and use beyond this range will lead to component and set damage. Typically, it is defined as the current value where the temperature increase is &#;40°C.
Now let&#;s look at how to determine these rated currents when used as a power inductor. As shown in Figure 1-3, the maximum current which flows through the inductor is Iout + &#;IL/2. When this current value exceeds Isat, the decrease in inductance becomes quite large; the shape of the exponential current becomes abnormal as shown by the red line in Figure 1-4, and the ripple current increases. Because the ripple current causes the output voltage to fluctuate, it induces abnormal system behavior on the load side when the ripple current increases. Therefore, you must choose a power inductor with an Isat that is greater than the maximum current.
At the same time, with regard to the temperature increase rated current, the inductor is not immediately damaged even if the rated value is exceeded. Accordingly, you should select an Itemp value which is greater than Iout as a general rule.
Figure 1-4 Ripple current fluctuations due to the DC superposition
The DC resistance is the resistance value when the direct current flows. Because power loss occurs through heat generation due to this resistance value, a lower DC resistance can reduce loss. However, reducing the Rdc involves a trade-off between the DC superposition characteristic and size miniaturization. Therefore, it is probably better to select an inductor with a smaller Rdc from among those inductors which satisfy the necessary characteristics such as inductance and the rated currents discussed above.
The operating temperature range stipulates the allowable range of ambient temperature when using an inductor. The effect of temperature can change even based on the circuit operating environment, so please select an inductor based on the expected practical use environment.
Now let&#;s take a look at an example of selecting a power inductor in an actual DC-DC converter. This example is based on the step-down DC-DC converter shown in Figure 1-5. It is expected to operate under the following conditions:
[Operating conditions]
Figure 1-5 Step-down DC-DC converter example
With the following equation, we see that the magnitude of the proper inductance is about 1.0 μH.
Moreover, because Iout = 1.5 A and &#;IL is 0.45 A at about 30% of Iout, the maximum current is as follows:
Iout+&#;IL/2&#;1.725A
Therefore, based on this result, we need an inductor with an Itemp of 1.5 A or more and an Isat of 1.8 A or more.
By using Murata&#;s design support software called the &#;SimSurfing / DC-DC Converter Design Support Tool,&#; you can search for the ideal item based on the required specification. For example, when the required values for inductance, size, Itemp, and Isat are entered from among the search items shown within the red frame in Figure 1-6, the items which match the conditions are listed within the blue frame.
Figure 1-6 Search conditions in the &#;SimSurfing&#; design support software
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You can also compare basic characteristics such as the DC superposition characteristic by selecting items.
In Figure 1-7, the following three items are selected to compare the superposition characteristic:
DFEF-1R0M
LQH2HPN1R0MGR
LQM2HPN1R0MGH
Based on these results, for this example, we can see that the DFEP-1R0M satisfies the required conditions and possesses low Rdc and high Isat characteristics.
Figure 1-7 Comparison of basic characteristics with the &#;SimSurfing&#; design support software
Starting from here, we will introduce the different types of power inductors. The Murata lineup includes power inductors with winding Metal Alloy, winding ferrite, and multilayer ferrite structures. We provide the optimal inductors for a wide range of applications from mobile devices such as wearables and smartphones to medical, industrial electronics, and automotive equipment.
Figure 1-8 Power inductors structures
Let&#;s take a look at the advantages and technologies behind each structure.
Winding Metal Alloy is an inductor which bonds the winding and resin-coated metal magnetic powder with thermocompression. It can be applied to high current areas in large-sized to small-sized products. While metal magnetic materials have a lower magnetic permeability when compared to the ferrite materials described below, they have superior DC superposition characteristics, so they are materials which are well-suited to high currents. As DC-DC converters have shifted toward high-speed switching in recent years, low inductance is required, so winding Metal Alloy is becoming a leading product in the majority of the market.
Moreover, the superior temperature characteristics compared to ferrite materials are also a major advantage. Because the fluctuations in magnetic permeability are small with regard to the ambient temperature, it can maintain stable DC superposition characteristics even at high temperatures. The wide-ranging target markets include automobiles, smartphones, HDDs, etc.
DFEC series
Figure 1-9 Structure and appearance of winding Metal Alloy
Winding Metal Alloy technologies include metal magnetic materials and their processing techniques as well as winding techniques using copper wire (Figure 1-10). At Murata, we have established material technologies which realize our own winding structure, high magnetic permeability, and insulation. By combining these technologies, we have improved the efficiency of achieving inductance, enabled low DC resistance, and created a product lineup which supports high currents.
Figure 1-10 Cross-sectional view of winding Metal Alloy
Winding ferrite&#; winds copper wire in a spiral shape around a ferrite core. Many of Murata&#;s winding ferrite products coat the copper wire, wound around the ferrite core, with a magnetic resin. The purpose of the resin coating is to reduce the leakage flux, improve the achievement of inductance, and increase the intensity. Because the magnetic permeability of ferrite material is high, there are advantages to selecting winding ferrite when using it in a high inductance area. The wide-ranging target markets include smartphones, TVs, HDDs, etc.
LQH_P series
LQH2MC_02 series
LQH2MC_52 series
Figure 1-11 Structure and appearance of winding ferrite
Figure 1-12 Cross-sectional view of winding ferrite
Multilayer ferrite is an inductor which alternately laminates and sinters the magnetic material and inner electrodes. Compared to the winding structure, it enables compact and low-profile form factors. While the cases where winding Metal Alloy is used to satisfy the demand for small size and low inductance have been increasing, the characteristics of multilayer ferrite will be needed in areas requiring a small size with a high inductance and high voltage.
LQM_F series
LQM_P series
Figure 1-13 Structure and appearance of multilayer ferrite
Multilayer ferrite technologies include ferrite material technology and technology for forming inner electrodes with a high aspect ratio, circuit design technology, and lamination technology (Figure 1-14). Murata has obtained high aspect technology for inner electrodes, which was not achievable with previous sheet lamination that enables us to provide even lower resistance. In addition, the magnetic path gap forming technology with a high degree of freedom suppresses magnetic saturation to achieve a vastly superior DC superposition characteristic. These technologies realize a product lineup which supports areas that require a compact and low-profile form factor.
Figure 1-14 Cross-sectional view of multilayer ferrite
Next, let&#;s compare the performance of these power inductor structures.
The primary factors for comparing power inductor performance are the 1) inductance value, 2) DC superposition characteristic, 3) temperature characteristic, 4) voltage endurance, and 5) leakage flux. Knowing these factors will enable you to select the power inductor structure which is suited to the required level of performance.
1) Inductance value
The range of obtainable inductance values is determined by the structure of the inductor. Winding ferrite can obtain a wide range starting from ferrite materials with a high magnetic permeability up to a high inductance of 10 uH or more. Due to the fact that multilayer ferrite is more compact when compared to winding ferrite, it achieves a low inductance of 10 uH or less. Winding Metal Alloy is noted for its low inductance of 10 uH or less due to its material characteristics.
Figure 1-15 Range of inductance by structure
2) DC superposition characteristic
A circuit which conducts a high current, such as a digital circuit, requires a power inductor with an inductance that does not decrease due to a high current, that is to say, a power inductor with a good DC superposition characteristic. This means that because the inductance does not decrease, the ripple currents are kept constant, and stable circuit operation can be maintained. In the case of winding Metal Alloy, because it is difficult for magnetic saturation to occur in comparison to ferrite, it possesses a superior DC superposition characteristic.
Figure 1-16 Superposition characteristic by structure
3) Temperature characteristic
When power inductors are used under high temperatures, such as in the power supply circuit of an automobile, the temperature characteristic becomes extremely important. Within magnetic materials, there is a temperature characteristic whereby the magnetic permeability changes according to the temperature, but metal magnetic materials have smaller changes in magnetic permeability due to temperature than ferrite materials and can be said to have superior characteristics.
In the case of winding Metal Alloy, there are no significant changes in the inductance value or the DC superposition characteristic. Figure 1-17 shows the DC superposition characteristics of winding Metal Alloy and ferrite products across a range of ambient temperatures from 25°C to 125°C. We can see that characteristic of winding Metal Alloy is unchanged between 25°C and 125°C.
Figure 1-17 Temperature characteristic by structure
4) Voltage endurance
It is important to pay attention to the power inductor voltage endurance in an LED or other voltage boosting circuit and power supply circuits with a high step-down voltage ratio. In the case of winding Metal Alloy, it ensures the insulation by covering the metal magnetic powder with an insulating resin, but the insulation tends to be lower when compared to winding ferrite. For this reason, while winding Metal Alloy possesses many superior characteristics, confirmation is required when using it in a high voltage endurance situation.
5) Leakage flux
The leakage flux from an inductor affects other circuits as noise which can lead to problems such as signal degradation and malfunctions particularly in power supply circuits with restrictions on the distance between components. The magnitude of the leakage flux is highly dependent on the structure of the inductor, and the closed magnetic circuit structures of the winding Metal Alloy and multilayer ferrite are helpful in this regard. This is because the winding Metal Alloy and multilayer ferrite enable you to reduce the leakage flux to the outside when trying to obtain the same inductance (Figure 1-18). The comparison results for leakage flux by structure are shown in Figure 1-19. From the results, we can see that the winding Metal Alloy and multilayer ferrite are able to suppress the leakage flux to low levels compared to the winding ferrite.
Figure 1-18 Cross-sectional views of winding Metal Alloy and multilayer ferrite
Figure 1-19 Leakage flux by structure
Table 1 summarizes the performance comparison. When selecting a power inductor, please refer to this table to select the inductor which is best suited to your application.
Table 1 Performance comparison by structure
Finally, we will introduce our lineup of recommended power inductors. Power inductor applications can be broadly categorized into general use and automotive use applications.
Winding Metal Alloy can take on a wide range of inductance values and sizes. Winding ferrite possesses an advantage as a high inductance product while the strength of multilayer ferrite lies in its compact size.
In Chapters 1.1 through 1.3, we explained how to look at the various power inductor characteristics and the differences in features due to the construction methods. However, we believe that what designers are most concerned about are not the power inductor characteristics but the performance when it is used in a DC-DC converter.
Figure 1-21 shows the efficiency measurement results for winding Metal Alloy and multilayer ferrite inductors with the same size and inductance values in a DC-DC converter. We can see in Figure 1-21 that the efficiency significantly differs by roughly 3% depending on the type of component.
However, regrettably this difference cannot be interpreted from the current specification being described. Selecting a product based on the actual performance requires a deeper understanding of power inductor characteristics and an evaluation based on the operating conditions of the DC-DC converter.
Accordingly, the next chapter will explain the operating principles of a DC-DC converter and the relationship between the performance of a DC-DC converter and the power inductor specification. It will also provide an example of how to evaluate the actual performance of a power inductor in a DC-DC converter using the Murata DC-DC Converter Design Support Tool.
Figure 1-21 Winding Metal Alloy and multilayer ferrite efficiency measurement results
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