Intended application: Selecting the right target material first requires an in-depth understanding of the application requirements of the film. Different applications (e.g., photovoltaics, semiconductors, decorative coatings) have different requirements for the electrical, optical and mechanical properties of thin films. Therefore, defining the application purpose and performance requirements of the film is the first step in target selection.
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Evaluate target properties: After determining the application needs of the film, the target needs to be selected based on its purity, compositional homogeneity, size and shape. For example, for highly transparent optical films, it is particularly important to select targets with uniform composition and high purity. For large-area coatings, target size and shape uniformity are critical to improving deposition efficiency and film uniformity.
Consider cost-effectiveness: When selecting targets, there is also a balance of cost-effectiveness to consider. While high-quality targets may cost more, they may be more economical in the long run by providing superior film performance and longer service life.
Equipment and target compatibility: Ensure that the specification, size and shape of the target purchased matches the equipment requirements, and that the physical and chemical properties of the selected material are suitable for the required application and equipment to ensure that it can be loaded and used correctly.
Sputtering method: For reactive sputtering or the preparation of thin films of specific compounds, targets matching the gases used in the sputtering process are required. High-frequency sputtering or magnetron sputtering are generally more suitable for using pure, homogeneous targets for stable deposition. Some sputtering methods may require targets of special shapes, sizes, or structures, such as magnetron sputtering, which improves target utilization. The choice of sputtering method needs to take into account the physical and chemical properties of the target to ensure that it is compatible with the process and that the desired film properties are obtained.
Conductivity: The higher the purity of the target, the higher the conductivity. In semiconductor and conductive film applications, trace impurities can significantly affect the conductivity of the material. High purity targets reduce these impurities and provide higher conductivity, which is critical for high performance electronics.
Specialized resources and guidance are critical to selecting the right target, and by partnering with AEM, a supplier of specialized sputtering targets, we will utilize our years of technical knowledge and experience to help you more accurately select the target that meets your needs.
With competitive price and timely delivery, Acetron sincerely hope to be your supplier and partner.
A thin film is a metal or metal-ceramic layer of material that is deposited, atom-by-atom, on the surface of a substrate. The thin film forms a bonded layer that changes the part's appearance, durability or function.
Thin films don't affect dimensional tolerance or the substrate's desired textures. They are used to improve a product's color, light reflection or refraction, hardness or electrical insulation and conductance.
Thin film thickness ranges from fractions of a nanometer (1 nm = 0. m = 10 angstroms) to several micrometers (1 μm = 0. m). For reference, the diameter of a human hair ranges from 17-181 μm. A strand of spider web silk has a width of 3 to 8 μm.
The controlled synthesis of materials as thin films (a process referred to as "deposition") is a crucial need in many industries. For example, architectural glass, displays, touch panels and solar cells all contain thin films. A familiar example is a mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface.
Two basic methods are used to create thin films: 1) Chemical deposition, where a fluid precursor undergoes a chemical change at a solid surface and 2) Physical deposition, which uses mechanical, electromechanical or thermodynamic means.
A type of physical deposition is physical vapor deposition (PVD), which occurs in a vacuum. Sputtering is a type of PVD.
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