The sputtering target materials commonly found on the market can be divided into planar targets and rotatory targets according to their shapes. Want to know what are their advantages and disadvantages? Keep on reading this post.
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Although rotary targets have developed in recent years, the mainstream shape of the sputtering target is still the planar type.
As for the planar target, its main advantages include simple structure, strong versatility, and good uniformity and repeatability of the film layer.
Simple structure &#; One of the main advantages of the planar target is its simple structure. Common shapes of planar targets on the market are rectangular and circular, which can be easily produced by molds. In other words, planar target preparation requires fewer machines and technologies and is easier to prepare. This is why planar targets still dominate the sputtering target market.
Low price &#; Price is always an important competitive factor. As mentioned above, the manufacturing process of the planar sputter target is easier, so its price is much lower than the rotatory sputter target.
Strong versatility &#; Planar sputtering targets usually have strong versatility. Therefore, the transportation process is relatively simple and the target materials are not easily damaged during transportation.
Good uniformity and repeatability &#; Film layers sputtered by planar targets usually boast good uniformity and repeatability. Planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.
The biggest disadvantage of the planar target is the low utilization rate (generally only about 20%). In the sputtering process of the planar target, a strip-shaped pit will be formed when the target of the glow region (the magnetic field distribution region) is consumed to a certain extent, making the target body thinner. And once the pit depth reaches a certain value, the target cannot be utilized anymore. The low utilization rate also reduces its price advantage to some extent.
More surface area -Rotatory targets usually have more surface area per given length compared to planar targets. Therefore, the magnetron power can be spread out over a larger area in a given amount of time, which helps keep the target running cooler, decreases nodule formation, and reduces the occurrence of arcing.
Compact structure &#; Rotary sputtering decreases nodule formation, and targets can have longer continuous runtimes.
High utilization rate &#; The main advantage of the rotatory target over the planar target is the higher target utilization (generally about 80%).
However, the rotatory target also has some unavoidable disadvantages in that there are many glow rings on the entire target surface during sputtering, so it cannot form a continuous strip glow.
The performance of different target shapes is related to specific preparation items and products, but we can come to a conclusion that rotary targets are more cost-effective for high-volume processes, while planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.
If you are still confused about choosing which type of sputtering target, please contact our sales team for help. Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, and ceramic materials. We promise to provide satisfying services for you.
Rotatable sputtering target, or rotatory target, is a commonly used target shape in magnetron sputtering. It is generally cylindrical, with a stationary magnet inside, and a slow magnetic field, which allows the sputtering rate to be uniform and the target utilization rate to be high. Rotating targets are commonly used for coating solar cells, architectural glass, automotive glass, semiconductors, and flat-panel TVs.
Rotatable sputtering targets, also known as rotatable cathodes or rotating targets, are specialized materials used in a sputtering deposition technique called magnetron sputtering. Sputtering is a physical vapor deposition (PVD) process, a high-speed process where superfast ions hit a sputtering target and dislodge minuscule particles, widely used in the semiconductor, electronics, and thin film industries to deposit thin films of various materials onto substrates.
In standard sputtering systems, a stationary sputtering target is used as the cathode, which is bombarded with high-energy ions to release atoms or molecules from its surface. However, in the case of rotatable sputtering targets, the target is mounted on a rotating shaft, allowing it to spin during the sputtering process.
1). Improved Uniformity: The rotation of the target helps achieve more uniform erosion and deposition across its surface. As the target rotates, different areas of the target are exposed to the ion bombardment, leading to more even erosion and deposition rates. This results in better film thickness uniformity and composition control across the substrate. 2). Increased Target Utilization: With a stationary target, erosion typically occurs in localized areas, leading to grooves or pits on the target surface. By rotating the target, the erosion is spread out over a larger surface area, reducing localized damage and extending the target's lifespan. This increased target utilization helps improve process efficiency and reduces downtime for target replacement. 3). Higher Deposition Rates: The rotational movement of the target can enhance the ionization and sputtering efficiency. The increased sputtering yield allows for higher deposition rates, reducing the overall process time required to achieve the desired film thickness. 4). Enhanced Film Quality: The improved target utilization and uniformity provided by rotatable targets contribute to better film quality. The increased uniformity helps minimize defects, impurities, and stress within the deposited films, resulting in improved electrical, optical, and mechanical properties.
Sprayed: FUNCMATER provides industry-leading thermal spray rotary targets, providing the best process stability and performance, including production methods such as plasma, arc and cold spray, enabling spray rotary targets with the most advanced density, purity and gas control. The main materials include:: AZO, Cr, CuGa , ITO, Mo, NbOx, Si, SiAl, Sn, TiOx, W alloys, Zn and its alloys (ZnSn and ZnAl), ZnO, ZrOx and ZTO. Cast: The main advantages are high compositional and microstructural consistency and purity control, which contribute to high process yields and long target lifetimes. Cast rotary products include In, InSn, Sn alloys, Zn alloys (ZnAl and ZnSn) and many other materials. Extruded: FUNCAMTER is an established supplier of high-purity extruded Al, Cu, Mo, Nb, Ni alloys (Cr and V), Ta, Ti, Zr, V and other materials. We provide application-specific custom solutions for extruded targets with respect to material characteristics, including purity and grain size. HIP/Sintered: Our products include Cr, NiFe as well as C, Mo and W alloys. FUNCMATER can perform direct hot isostatic pressing on the backing tubes of certain materials, enabling high power use without the use of solder. Bonded: FUNCMATER offers bonding solutions for metal and ceramic rotating targets, using In and elastomer bonding, for a wide variety of materials including AZO, C, Cr, Mo, Si and others.
If you want to learn more, please visit our website rotary sputter target.
Our rotating sputtering targets have a unique combination of properties that provide safe operation and stable processes even at higher sputtering powers
Our production capabilities allow us to manufacture rotatable targets in large sizes: up to 3.9 meters in length and up to 225 mm in diameter.
Our high quality rotatable (cylindrical) targets, even with the "dog bone" profile, are joint-free and have a strong bond (no indium) on the back tube.
These features allow for high power sputtering and enable users to sputter material down to the last millimeter - meaning better material usage and lower cost of ownership than traditional straight cylindrical models.
Our proprietary technology also allows us to reuse backing tubes with minimal material waste for cost-effective solutions.
Materials
Rotatable Sputtering Targets
Metal
Rotatory aluminum target, Rotatory molybdenum target, Rotatory copper target, Rotatory titanium target, Rotatory tungsten target, Rotatory zirconium target, Rotatory nickel target, Rotatory niobium target, Rotatory indium target, Rotatory ytterbium target, Rotatory silicon target
Oxides
Rotatory ATO Sputtering Target, Rotatory ITO Sputtering Target, Rotary Nb2O5 sputtering target, Rotatory TiOx sputtering target, Rotatory Al2O3 sputtering target
Alloys
Ni-Cr alloy rotatory sputtering target
Rotatable sputtering targets are commonly used in applications where high-quality and large-area thin films are required, such as flat panel displays, architectural glass coatings, solar cells, and magnetic storage media. It's important to note that the design and specifications of rotatable sputtering targets can vary depending on the specific sputtering system and application requirements.
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